Передовое производство печатных плат

и электронных модулей в России, Европе, ЮВА и США

Тел./факс:

+7 (495) 150 37 50

+7 901 517 50 55

Технические характеристики
Antipad over drill 0.020” [0.5mm] 0.014” [0.36mm]
Outer Layer Trace/Space

0.004”/0.004”
[101μm/101μm]

0.0025”/0.003”
[63.5μm/76μm]

Inner Layer Trace/Space

0.004”/0.004”
[101μm/101μm]

0.002”/0.0025”
[50μm/63.5μm]

 Maximum PTH aspect ratio  0:1  30:1
 Maximum PCB thickness  0.250” [6.35mm]  0.300” [7.62 mm]
 Maximum copper weight  3 oz [107μm]  5 oz [178μm]
 Maximum layer count  2-24  26-60
 Maximum mechanical drill size  0.257” [6.53mm]  0.257” [6.53mm]
 Maximum panel size  21” x 24”  24” x 30”
 Minimum PCB thickness  0.021” [0.53mm]  0.008” [0.2mm]
 Minimum copper weight  1/2 oz [18μm]  1/8 oz [4.5μm]
 Minimum core thickness  0.002” [50μm]  0.001” [25μm]
 Minimum dielectric  0.0025” [63.5μm]  0.0015” [38μm]
 Minimum mechancial drill size  0.008” [0.2mm]  0.004” [101μm]
 Pad Size = Drill + [x]; shall meet IPC-6012 Class 2  0.010” [0.25mm] 0.008” [0.2mm]

[w/tear drop]

 Solder mask registration  +/- 0.0025” [63.5μm]  +/- 0.0015” [38μm]
 Copper feature to PCB edge  0.020” [0.5mm]  0.010” [0.25mm]